HOSOPM®0-T is a registered trademark for our copper tungsten materials used in heat sink applications. Our copper tungsten material for heat sinks does not include third-party elemental additives, ensuring it has very high density and high thermal conductivity.
HOSOPM®T copper tungsten specification:
|
|
composite (wt.%) |
Density (g/cm³) |
Thermal conductivity (W/m²K) |
CTE(10-6/K) |
|
HOSOPM®075T |
Cu25W75 |
14.7 |
200~230 |
9.0~9.5 |
|
HOSOPM®080T |
Cu20W80 |
15.5 |
190~210 |
8.0~8.5 |
|
HOSOPM®085T |
Cu15W85 |
16.4 |
180~200 |
7.0~7.5 |
|
HOSOPM®090T |
Cu10W90 |
17.0 |
160~180 |
6.3~6.8 |
HOSOPM®T material metallograph:
| Magnification x200 | Magnification x1000 |
 |
 |
HOSOCP®0-T is our registered trademark for copper tungsten heat thermal management devices. From raw materials to final parts, HOSO offers a one-stop service. Our off-the-shelf copper tungsten heat sink products have received many approvals from our customer.
It is widely used as the base plate for optoelectronics, high-frequency applications, power electronics, and microelectronics. Off-the-shelf copper tungsten heat sink blocks:
copper tungsten heat sink WITH Ni-plating:
