HOSOPM®0-T is registered trademark of copper tungsten material use for the heat sink application. Our copper tungsten material for heat sink application without the third party elemental added so it has very high density and high thermal conductivity.
HOSOPM®T copper tungsten specification:
|
|
composite (wt.%) |
Density (g/cm³) |
Thermal conductivity (W/m²K) |
CTE(10-6/K) |
|
HOSOPM®075T |
Cu25W75 |
14.7 |
200~230 |
9.0~9.5 |
|
HOSOPM®080T |
Cu20W80 |
15.5 |
190~210 |
8.0~8.5 |
|
HOSOPM®085T |
Cu15W85 |
16.4 |
180~200 |
7.0~7.5 |
|
HOSOPM®090T |
Cu10W90 |
17.0 |
160~180 |
6.3~6.8 |
HOSOPM®T material metallograph:
| Magnification x200 | Magnification x1000 |
 |
 |
HOSOCP®0-T is our registered trade mark for copper tungsten heat thermal management device. From the copper tungsten raw material to the final parts, HOSO offer the one stop serivce .Our copper tungsten heat sink off shelf product got many certificate from our customer.
It is weldly used as the base plate of opto-electronics, high-frequency applications, power electronics and micro-electronics.
off-the-shelf copper tungsten heat sink block:
copper tungsten heat sink WITH Ni-plating:
