copper tungsten heat sink, IPC base plate,IC substrate,package

copper tungsten is the pseudo-alloy, he has the advantage of the high thermal conductivity of copper and the stable of tungsten. It is easy to adjust the CTE( coefficient of thermal expansion)by use the different ratio of copper and tungsten.

copper tungsten heat sinkHOSOMETEAL can machining the copper tungsten heat thermal management device according to customer’s drawing.From the copper tungsten raw material to the final parts, HOSOMETAL offer the one stop serivce .Our copper tungsten heat sink off shelf product got many certificate from our customer.
It is weldly used as the base plate of opto-electronics, high-frequency applications, power electronics and micro-electronics.
HOSOPM®T is our register brand for copper tungsten heat sink product. The product advantage:
  • without third party elemental add 
  • high thermal conductivity
  • fast delivery
HOSOPM®T copper tungsten specification:

composite(wt.%)

Density

(g/cm³)

Electrical conductivity (%IACS)

Thermal conductivity (W/m²K)

CTE(10-6/K)

HOSOPM®070T

13.80

42

~240

~9.7

HOSOPM®075T

14.50

38

200~230

9.0~9.5

HOSOPM®080T

15.20

34

190~210

8.0~8.5

HOSOPM®085T

16.10

30

180~200

7.0~7.5

HOSOPM®090T

16.80

28

160~180

6.3~6.8

copper tungsten heat sink block:

cuw heat sink off shelf

copper tungsten heat sink WITH Ni-plating:

copper-tungsten-heat-sink-with-ni-plating