HOSOMETAL supply the copper tungsten heat sink and heat management device.
Electronic packaging is to put a certain function of the integrated circuit chips (including semiconductor integrated circuit chips, thin film integrated circuit substrate, hybrid integrated circuit chips) placed in a corresponding shell container, which can provide a stable environment to protect chips work normally and keep stable functions in integrated circuit. At the same time, encapsulation also is connection method of outputting and inputting to make the transition to outside, and it can form a completed entirety with chips. Electronic packaging material are requested certain mechanical strength, good electrical properties, thermal properties and chemical stability. According to the different type of integrated circuit and practical place, we choose different packaging structure and materials.